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NXP Semiconductors
Table 8.
Characteristics
IP4358CX6
Quad channel low capacitance ESD protection
Symbol
Parameter
Conditions
Min Typ Max Unit
T reflow(peak)
peak reflow temperature
230 -
260
° C
t 1
t 2
t 3
t 4
t 5
dT/dt
time 1
time 2
time 3
time 4
time 5
rate of change of temperature
soak time
time during T ≥ 250 ° C
time during T ≥ 230 ° C
time during T > 217 ° C
cooling rate
preheat
60
-
10
30
-
-
2.5
-
-
-
-
-
-
-
180
30
50
150
540
? 6
4.0
s
s
s
s
s
° C/s
° C/s
9. Abbreviations
Table 9.
Acronym
DUT
DVI
ESD
FR4
HDMI
NSMD
NWA
OSP
PCB
RoHS
USB
WLCSP
10. Revision history
Abbreviations
Description
Device Under Test
Digital Visual Interface
ElectroStatic Discharge
Flame Retard 4
High Definition Multimedia Interface
Non-Solder Mask Defined
NetWork Analyzer
Organic Solderability Preservative
Printed-Circuit Board
Restriction of Hazardous Substances
Universal Serial Bus
Wafer-Level Chip-Scale Package
Table 10.
Revision history
Document ID
IP4358CX6 v.1
Release date
20101018
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
IP4358CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
? NXP B.V. 2010. All rights reserved.
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